Research on BGA Solder Joint Reliability Based on Finite Element Analysis

LU Jia

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Research on BGA Solder Joint Reliability Based on Finite Element Analysis

更新时间：2026-09-04

- Research on BGA Solder Joint Reliability Based on Finite Element Analysis
- Vol. 27, Issue 3, Pages: 113-118(2010)
- 作者机构：
  
  中国工程物理研究院机构电子工程研究所,四川,绵阳,621900
- 作者简介：
- 基金信息：
- DOI：
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- Published：2010
- 稿件说明：
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路佳. 基于有限元分析的BGA焊点可靠性研究[J]. 微电子学与计算机, 2010, 27(3): 113-118.

LU Jia. Research on BGA Solder Joint Reliability Based on Finite Element Analysis[J]. 2010, 27(3): 113-118.
路佳. 基于有限元分析的BGA焊点可靠性研究[J]. 微电子学与计算机, 2010, 27(3): 113-118. DOI：

LU Jia. Research on BGA Solder Joint Reliability Based on Finite Element Analysis[J]. 2010, 27(3): 113-118. DOI：

摘要

介绍了应用最小能量原理对球栅阵列 (BGA) 器件焊点建立三维形态预测模型

以及利用有限元方法分析不同形态焊点在热循环条件下的应力应变分布特征.基于分析结果对三种不同引脚中心距的BGA进行组装工艺优化设计

通过环境筛选试验的验证

考核了工艺设计的可靠度.证明热应力交变下

焊点内部疲劳损伤现象与理论预测一致

有限元分析 (FEA) 在焊点可靠性研究中是一种有效的途径.

Abstract

This paper develops 3-D shape predicting model of BGA through minimal energy principle

analyses stress distributing characteristic of different shape solder joint under thermal cycle.Based on analysis result

assembly technology is optimized of three kind of BGA with different lead center distance.Validated by environment screen testing

technical dising reliability is examined.The result indicates that

solder joint inner fatigue failure phenomenon is consistent with theory prediction under thermal stress

finite element analysis is an effective in solder joint reliability research.

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