A Stacking Scheme Using Adjacent Redundancy Across Dies for 3D-stacked Memory

LIU Jun; LI Jin; WANG Wei; REN Fu-ji

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A Stacking Scheme Using Adjacent Redundancy Across Dies for 3D-stacked Memory

更新时间：2026-09-04

- A Stacking Scheme Using Adjacent Redundancy Across Dies for 3D-stacked Memory
- Vol. 34, Issue 7, Pages: 1-6(2017)
- 作者机构：
  
  1. 合肥工业大学计算机与信息学院,安徽,合肥,230009
  2. 情感计算与先进智能机器安徽省重点实验室机构,安徽,合肥,230009
  3. 日本德岛大学先端技术科学教育部, 日本德岛 7708502
- 作者简介：
- 基金信息：
- DOI：
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- Published：2017
- 稿件说明：
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刘军, 李进, 王伟, 任福继. 基于相邻多层冗余共享的三维存储器堆叠方法[J]. 微电子学与计算机, 2017, 34(7): 1-6.

LIU Jun, LI Jin, WANG Wei, et al. A Stacking Scheme Using Adjacent Redundancy Across Dies for 3D-stacked Memory[J]. 2017, 34(7): 1-6.
刘军, 李进, 王伟, 任福继. 基于相邻多层冗余共享的三维存储器堆叠方法[J]. 微电子学与计算机, 2017, 34(7): 1-6. DOI：

LIU Jun, LI Jin, WANG Wei, et al. A Stacking Scheme Using Adjacent Redundancy Across Dies for 3D-stacked Memory[J]. 2017, 34(7): 1-6. DOI：

摘要

为提高三维存储器的成品率和减少冗余行列所需的TSVs的数量

提出每一层存储块都与相邻上下两层共享冗余的三维存储器冗余共享结构

并给出了一种新的堆叠方案

将故障较多与较少的芯片交替堆叠.实验结果表明

该结构在有效控制TSVs数量增长的前提下

提高了三维存储器的修复率.

Abstract

To improve the yield and the number of TSVs used in spare rows and columns

this paper proposed a sharing structure of adjacent redundancy across dies. Besides

based on the new redundancy sharing structure

a die-selection method stacking alternative memory layers with different number of faults was also presented. Experimental results show that the proposed method can significantly increase memory yield with relatively small area overhead of TSVs.

关键词

Keywords

references

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