Resistive random access memory (RRAM) is a high-performance nonvolatile memory with the feature of small area
low operation voltage
and good compatibility. However
when frequent writing operation at high density integration
the crosstalk problem will seriously influence the retention properties of RRAM
which is common to create some error flips in serious conditions. Therefore
we present an effective parity rearrangement coding scheme
that is PRCoder
to reduce the influence in RRAM. We present the PRCoder at algorithm level and emulate it at hardware level for various scenarios. Experiments indicate that PRCoder can decrease the accidentally flips by about 32.7% on average
which is caused by thermal crosstalk
with just one additional bit of redundancy per storage line. Moreover
PRCoder causes an ignorable performance spending of ~0.3% with inferior to 0.008% extra RRAM area.
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references
Ninomiya T, Muraoka S, Wei Z, et al. Improvement of data retention during long-term use by suppressing conductive filament expansion in taox bipolar-reram[J]. IEEE Electron Device Letters, 2013, 34(6): 762-764. DOI: 762
Xue X, Jian W, Yang J, et al. A 0.13um 8Mb logic-based cuxsiyo reram with self-adaptive operation for yield enhancement and power reduction[J]. Solid State Circuits IEEE Journal of, 2013, 48(5): 1315-1322. DOI: 1315
Russo U, Ielmini D, Cagli C, et al. Self-accelerated thermal dissolution model for reset programming in unipolar resistive-switching memory (RRAM) Devices[J]. Electron Devices, IEEE Transactions on, 2009, 56(2): 193-200. DOI: 193
Yalon E, Riess I, Ritter D. Heat dissipation in resistive switching devices: comparision of thermal simulations and experimental results[J]. Electron Devices, IEEE Transactions on, 2014, 61(4): 1137- 1144. DOI: 1137
Li Y, Chen W, Lu W, et al. Impact of coupling capacitance on read operation of RRAM devices in 1D1R crossbar architectures[C]//Circuits and Systems(MWSCAS), 2014 IEEE 57th International Midwest Symposium on. Piscataway, NJ: IEEE, 2014: 989-992.
Sato Y, Kinoshita K, Aoki M, et al. Consideration of switching mechanism of binary metal oxide resistive junctions using a thermal reaction model[J]. Applied Physics Letters, 2007, 90(3): 033503. DOI: 033503
Chen Z, Huang P, Li H, et al. Optimization of uniformity in resistive switching memory by reducing thermal effect[C] //Solid-State and Integrated Circuit Technology(ICSICT), 2014 12th IEEE International Conference on. Piscataway, NJ: : IEEE, 2014: 1-3.
Guo X, Schindler C, Menzel S, et al. Understanding the switching-off mechanism in Ag+ migration based resistively switching model systems[J]. Applied Physics Letters, 2007, 91(13): 042107. DOI: 042107
Huang J J, Hou T H, Hsu C W, et al. Flexible one diode-one resistor crossbar resistive-switching memory[J]. Japanese Journal of Applied Physics, 2012, 51(4S): 04DD9. DOI: 04DD9
Li H, Chen H Y, Chen Z, et al. Write disturb analyses on half-selected cells of cross-point RRAM array[C]//Reliability Physics Symposium, 2014 IEEE International. Piscataway, NJ: IEEE, 2014.
Bersuker G, Gilmer D C, Veksler D, et al. Metal oxide RRAM switching mechanism based on conductive filament microscopic properties[C]//Electron Devices Meeting(IEDM), 2010 IEEE International. San Francisco, California, USA, IEEE, 2010, 19(6): 1-4.
Lin S, Zhao L, Zhang J, et al. Electrochemical simulation of filament growth and dissolution in conductive-bridging RAM (CBRAM) with cylindrical coordinates[C]//Proceedings of the Electron Devices Meeting (IEDM), 2012 IEEE International. San Francisco, CA, USA, IEEE, 2012, 26(3): 1-4.
Lian W, Long S, Lu H, et al. Approaches for improving the performance of filament-type resistive switching memory[J]. Chinese Science Bulletin, 2011, 56(4/5): 461-464. DOI: 461
Guan W, Liu M, Long S, et al. On the resistive switching mechanisms of Cu/ZrO2: Cu/Pt[J]. Applied Physics Letters, 2008, 93(22): 223506. DOI: 223506