Design and Implementation of a Ka-K Band Receiver Andtransmiter 3D SiP Module

WANG Xin; LIU Feng-man; WU Peng; WANG Qi-dong; CAO Li-qiang

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Design and Implementation of a Ka-K Band Receiver Andtransmiter 3D SiP Module

更新时间：2026-09-04

- Design and Implementation of a Ka-K Band Receiver Andtransmiter 3D SiP Module
- Vol. 34, Issue 8, Pages: 113-117(2017)
- 作者机构：
  
  1. 中国科学院机构微电子研究所,北京,100029
  2. 华进半导体封装先导技术研发中心有限公司,江苏,无锡,214135
  3. 中国科学院大学机构,北京,100049
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Published：2017
- 稿件说明：
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汪鑫, 刘丰满, 吴鹏, 王启东, 曹立强. Ka-K波段收发模块的3D系统级封装(SiP)设计[J]. 微电子学与计算机, 2017, 34(8): 113-117.

WANG Xin, LIU Feng-man, WU Peng, et al. Design and Implementation of a Ka-K Band Receiver Andtransmiter 3D SiP Module[J]. 2017, 34(8): 113-117.
汪鑫, 刘丰满, 吴鹏, 王启东, 曹立强. Ka-K波段收发模块的3D系统级封装(SiP)设计[J]. 微电子学与计算机, 2017, 34(8): 113-117. DOI：

WANG Xin, LIU Feng-man, WU Peng, et al. Design and Implementation of a Ka-K Band Receiver Andtransmiter 3D SiP Module[J]. 2017, 34(8): 113-117. DOI：

摘要

介绍了一种基于有机基板堆叠的高密度多芯片模块的新型三维系统封装（SiP）设计.该模块是工作在Ka波段（发射）和K波段（接收）的SiP.有机基板通过球栅阵列（BGA）堆叠，将收发模块与两个不同频段的天线集成在一起.对于有源芯片部分，包括单片式微波集成电路（MMIC）互连的邦定线设计，电磁辐射隔离和大功率芯片的散热处理；对于无源元件部分，主要包括微带式带通选频滤波器，DC-AC隔离块和天线设计.该系统把收发天线也集成在了毫米波前端里，系统具有多频段、小型化、低轮廓、高增益的优势，在未来毫米波无线通信系统中具有广阔的应用前景.

Abstract

This paper demonstrates the three-dimensional system in package (SiP) design for high-density multi-chip modules based on organic substrate stacking. TheSiPmodule is operating in Ka-band (transmit) and K-band (receive). The organic substrate is stacked with a ball grid array (BGA) to integrate the transceiver module with the two frequency band antennas. For the active-chip part

the bonding wire design

the electromagnetic radiation isolation and the heat treatment of the high-power chip are the focus of this paper. For the passive components

including microstrip bandpass filter

DC-AC isolation block and antenna design. The system has a multi-band

miniaturization

low profile

high gain advantage

in the future millimeter-wave wireless communication system has broad application prospects.

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references

Xu Z Q, Xia H, Wang P, et al. A LTCC cavity filter for MMW transceiver module application[C]//2011 International Conference on. Chengdu, 2011: 627-630.

Evans J V. Proposed US global satellite systems operating at Ka-band[C]//Aerospace Conference, 1998. IEEE, 1998: 525-537.

Weng C C, Chang C F, Chung S J. Development of a compact low-temperature co-fired ceramic antenna front-end module[J]. Microwave Theory and Techniques, IEEE Transactions on, 2008, 56: 2483-2492. DOI: 2483

Chin S, Chang CC, Chen C H, et al. LTCC multilayered substrate-integrated waveguide filter with enhanced frequency s electivity for system-in package Applications, [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 4(4): 664-672. DOI: 664

Yeo S K, Chun J H, Kwon Y S. A 3-D X-Band T/R module package with an anodized aluminum multilayer substrate for phased array radar applications[J]. Advanced Packaging, IEEE Transactions on, 2010, 33: 883-891. DOI: 883

Lee Y C, Chang W I, Park C S. Monolithic LTCC SiP transmitter for 60GHz wireless communication terminals Microwave Symposium Digest[C]//2005 IEEE MTT-S International. IEEE, 2005: 1015-1018.

Meniconi E, Ziegler V, Sorrentino R, et al. 3D integration technologies for a planar dual band active array in ka-band[C]//Microwave Conference (EuMC), 2013 European. IEEE, 2013: 215-218.

Holzwarth S, Kulke R, Kassner J. Integrated stacked patch antenna array on LTCC material operating at 24 GHz[automotive radar applications] [C]//Antennas and Propagation Society International Symposium, 2004. IEEE, 2004: 1583-1586.

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