A Crosstalk Suppression Design Method in TSV Array

CHEN Si-yuan; FAN Xing; JIANG Jian-fei; WANG Qin

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A Crosstalk Suppression Design Method in TSV Array

更新时间：2026-09-04

- A Crosstalk Suppression Design Method in TSV Array
- Vol. 35, Issue 7, Pages: 19-22(2018)
- 作者机构：
  
  1. 上海交通大学电子信息与电气工程学院,上海,200240
  2. 上海航天局,上海,201108
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Published：2018
- 稿件说明：
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陈思远, 范鑫, 蒋剑飞, 王琴. 一种TSV阵列的串扰抑制设计方法[J]. 微电子学与计算机, 2018, 35(7): 19-22, 27.

CHEN Si-yuan, FAN Xing, JIANG Jian-fei, et al. A Crosstalk Suppression Design Method in TSV Array[J]. 2018, 35(7): 19-22.
陈思远, 范鑫, 蒋剑飞, 王琴. 一种TSV阵列的串扰抑制设计方法[J]. 微电子学与计算机, 2018, 35(7): 19-22, 27. DOI：

CHEN Si-yuan, FAN Xing, JIANG Jian-fei, et al. A Crosstalk Suppression Design Method in TSV Array[J]. 2018, 35(7): 19-22. DOI：

摘要

为了抑制TSV阵列中的串扰

本文建立TSV阵列的RC模型

通过在TSV阵列中使用一对差分TSV

分析差分TSV对于串扰的抑制效果

通过评估阵列中每点的串扰影响大小

得出优化的设计方法.文本基于电磁场仿真工具

建立TSV阵列模型

并完成仿真

提出3×3 TSV中最优的差分TSV排布.本文中的分析及仿真结果表明

3×3 TSV阵列使用差分TSV比直接使用单端TSV的串扰噪声至少降低4 db

并通过比较得到了最佳的差分TSV排布.

Abstract

In order to reduce the crosstalk in TSV Array

this paper builds an RC model of TSV Array

uses a pair of differential TSVs in it

analyzes the crosstalk suppression

estimates the crosstalk influence of each point in the array and gets an optimized design method. 3×3 TSV Array model is built and simulated by electromagnetic field simulation tool

which is used to find optimal differential TSVs arrangement. Analysis and results of research indicate that the crosstalk noise of using differential TSVs will decrease at least 4 db comparing to only using single-ended TSV

and finally get optimal arrangement of differential TSVs.

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references

Subrahmanya P, Manimegalai R, Kamakoti V, et al. A bus encoding technique for power and cross-talk minimization[C]// International Conference on Vlsi Design. Mumbai, India, IEEE Computer Society, 2004: 443.

Mirosanlou R, Taram M, Shirmohammadi Z, et al. 3DCAM: a low overhead crosstalk avoidance mechanism for TSV-Based 3D ICs[C]// International Conference on Computer Design. Las Vegas, Nevada, USA, 2015.

Kaul H, Sylvester D, Blaauw D. Active shields: a new approach to shielding global wires[C]// ACM Great Lakes Symposium on Vlsi 2002, New York. DBLP, 2002: 112-117.

Zou Q, Niu D, Cao Y, et al. 3DLAT: TSV-based 3D ICs crosstalk minimization utilizing less adjacent transition code[C]// Design Automation Conference. San Francisco, CA, USA, IEEE, 2014: 762-767.

Chang Y Y, Huang S C, Narayanan V, et al. ShieldUS: A novel design of dynamic shielding for eliminating 3D TSV crosstalk coupling noise[C]// Design Automation Conference. San Francisco, CA, USA, IEEE, 2013: 675-680.

朱健. 3D堆叠技术及TSV技术[J].固体电子学研究与进展, 2012, 32 (1) :73-77. DOI: 73

Vaisband B, Friedman E G. Hexagonal TSV bundle topology for 3D ICs[J]. IEEE Transactions on Circuits % Systems Ⅱ Express Briefs, 2016, 64(1):11-15. DOI: 11

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