探究了电荷不平衡、漂移区厚度、衬底反向扩散以及表面结构等对击穿电压和比导通电阻的影响.对元胞结构的优化使得超结VDMOS由最初的击穿电压为587 V
比导通电阻为7.27 mΩ·cm
优化到最终的击穿电压为662.5V
比导通电阻为6.85mΩ·cm
性能得到明显改善.
Abstract
Based on the charge compensation principle
the super junction VDMOS (Super-Junction VDMOS
SJVDMOS) device has lower specific on-resistance and higher breakdown voltage than the traditional VDMOS. This paper introduces the super junction VDMOS cell design steps in detail. The TCAD is used to simulate the breakdown voltage and the specific on-resistance of super-junction VDMOS. The effects of charge imbalance
drift zone thickness
substrate back diffusion and surface structure on the breakdown voltage and specific on-resistance are investigated. The optimization of cell structure improves the performance of the super junction VDMOS obviously. The initial breakdown voltage improves from 587V to 662.5V
and the specific on-resistance declines from 7.27 mΩ·cm to 6.85 mΩ·cm.
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references
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