When the channel temperature of GaN high electron mobility transistor (GaN HEMT) is too high
the performance of the device is degraded. To solve this problem
a new structure is proposed
the channel temperature is reduced by optimizing the electric field. The barrier layer under the new structure gate is called the mixed barrier layer
which consists of two layers
the upper layer is AlN and the lower layer is heavily doped AlGaN. In addition
the field plate is also introduced to change the channel electric field. For better heat dissipation
the passivation layer material of the new structure is AlN instead of SiN
because it has a higher thermal conductivity. Compared with the traditional structure
the channel temperature distribution of the new structure is more uniform
and the channel temperature peak drops by 47K. In addition
the breakdown voltage of the new structure is increased by 50%
and the output characteristics are also improved.
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references
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