A new TSV fault-tolerant architecture for clustered faults based on diamond burster

ZUO Xiao-han; LIANG Hua-guo; YANG Zhao; SHU Yue; JIANG Cui-yun

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A new TSV fault-tolerant architecture for clustered faults based on diamond burster

更新时间：2026-09-04

- A new TSV fault-tolerant architecture for clustered faults based on diamond burster
- Vol. 37, Issue 11, Pages: 48-53(2020)
- 作者机构：
  
  1. 合肥工业大学电子科学与应用物理学院,合肥,230009
  2. 合肥工业大学数学学院,安徽,合肥,23009
- 作者简介：
- 基金信息：
- DOI：
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- Published：2020
- 稿件说明：
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左小寒, 梁华国, 杨兆, 束月, 蒋翠云. 基于菱形分组器的TSV聚簇故障容错结构[J]. 微电子学与计算机, 2020, 37(11): 48-53.

ZUO Xiao-han, LIANG Hua-guo, YANG Zhao, et al. A new TSV fault-tolerant architecture for clustered faults based on diamond burster[J]. 2020, 37(11): 48-53.
左小寒, 梁华国, 杨兆, 束月, 蒋翠云. 基于菱形分组器的TSV聚簇故障容错结构[J]. 微电子学与计算机, 2020, 37(11): 48-53. DOI：

ZUO Xiao-han, LIANG Hua-guo, YANG Zhao, et al. A new TSV fault-tolerant architecture for clustered faults based on diamond burster[J]. 2020, 37(11): 48-53. DOI：

摘要

基于硅通孔的三维集成电路具备低互连延时、高密度、低功耗等优势.然而

由于不成熟的工艺技术

TSV制造堆叠及芯片绑定过程容易引入微孔、泄漏等缺陷

造成TSV故障.并且

这些TSV故障易呈现聚簇分布

严重降低三维集成电路的良率.针对TSV聚簇故障

本文提出了一种新的基于菱形分组器的TSV聚簇故障容错结构.以菱形分组器将TSV蜂窝阵列划分为若干TSV组

为每组配置相应的修复资源

达到分散TSV聚簇故障后逐个修复的目的

并以数据选择器链共享修复资源.实验结果表明

本文结构针对聚簇或均匀分布的TSV故障修复率均达到了99%

远高于同类方法

良好适用于修复TSV聚簇及均匀故障.

Abstract

The three-dimensional integrated circuit based on though-silicon-vias has the advantages of low interconnect delay

high density and low power consumption. However

due to the immature technology

the manufacturing

stacking of TSVs and the binding of chips are prone to introduce micro-hole

leakage and other defects

causing TSV faults. Moreover

these TSV faults tend to distribute clustered

which seriously reduces the yield of three-dimensional integrated circuit. A new TSV fault-tolerant architecture for clustered faults based on diamond burster is proposed in this paper. The TSV honeycomb block is divided into several TSV groups by diamond burster

and corresponding repair resources are configured for each group

so as to disperse the clustered TSV faults and repair them one by one. Multiplexer-chains are used to share the repair resources. Experimental results show that the repair rates of the proposed architecture for clustered or uniformly distributed TSV faults maintain above 99%

far higher than similar method

which indicates that the proposed architecture is well applicable to repairing clustered and uniformly distributed TSV faults.

关键词

Keywords

references

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FRANK T, MOREAU S, CHAPPAZ C, et al. Reliability of TSV interconnects: electromigration, thermal cycling, and impact on above metal level dielectric[J]. Microelectronics Reliability, 2013, 53(1): 17-29. DOI:10.1016/j.microrel.2012.06.021.

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