The deformation and failure process of adhesive interface specimen under tension was observed. By digital speckle correlation method (DSCM) to deal with images

displacement and strain field of speciman surface varying with load and their evolution process were achieved. The results show that during the tensile process the adhesive interface specimen with stress-release flap could be vulnerable crack at the tip of stress-release flap because of strain concentration. DSCM is an effective experimental method for studying characteristic of deformation and failure of adhesive interface specimen. The quantificational measurement results of adhesive interface deformation field are consistent with the data obtained from the experiment.