Research on Physical Properties of Sn-Ag-Cu-Sb Solder

GUI Tai-long; YUAN Li-peng; HAO Long; JIA Wei; DONG Xiao-li

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Research on Physical Properties of Sn-Ag-Cu-Sb Solder

更新时间：2026-07-10

- Research on Physical Properties of Sn-Ag-Cu-Sb Solder
- Vol. 16, Issue 1, Pages: 22-24(2011)
- 作者机构：
  
  哈尔滨理工大学应用科学学院
- 作者简介：
- 基金信息：
- DOI：
  CLC： TG42
- Published：2011
- 稿件说明：
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GUI Tai-long, YUAN Li-peng, HAO Long, et al. Research on Physical Properties of Sn-Ag-Cu-Sb Solder[J]. 2011, 16(1): 22-24.
DOI：

GUI Tai-long, YUAN Li-peng, HAO Long, et al. Research on Physical Properties of Sn-Ag-Cu-Sb Solder[J]. 2011, 16(1): 22-24. DOI：

摘要

为了获得不同性能的电子封装焊料

制备了掺杂Sb(锑)的Sn-3.35Ag-0.7Cu无铅焊料合金

并对其密度、杨氏模量、硬度等重要物理性能进行了测定.测得该无铅焊料的密度为7.210 6 g/cm3

杨氏模量为43 GPa

硬度为96.7 N/mm2.实验结果表明

同未掺杂Sn-3.35Ag-0.7Cu焊料合金相比

硬度略有降低

熔点下降不明显

但密度有显著降低

杨氏模量、润湿性有明显的提高.

Abstract

We prepare of the doped Sb(antimony) of the Sn-3.35Ag-0.7Cu lead-free solder alloy.Its important physical properties were measured: density

Young’s modulus

hardness and so on.The density is 7.210 6g/cm3

Young’s modulus is 43GPa

and the hardness is 96.7 N/mm2.The experimental results show that non-doped with Sn-3.35Ag-0.7Cu solder alloys

the hardness slightly lower

the melting points do not drop obviously than that not doped.However

there is a significant reduction in density.Young’s modulus and wetting p pr...

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