Electromigration of SnAgCu-Bi-Ni Pb-free Micro Solder Joints

SUN Feng-lian; WANG Jia-bing; LIU Yang; WANG Guo-jun

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Electromigration of SnAgCu-Bi-Ni Pb-free Micro Solder Joints

更新时间：2026-07-10

- Electromigration of SnAgCu-Bi-Ni Pb-free Micro Solder Joints
- Vol. 17, Issue 3, Pages: 1-4(2012)
- 作者机构：
  
  1. 哈尔滨理工大学材料科学与工程学院
  2. 东北轻合金有限公司
- 作者简介：
- 基金信息：
- DOI：
  CLC： TG425.1
- Published：2012
- 稿件说明：
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SUN Feng-lian, WANG Jia-bing, LIU Yang, et al. Electromigration of SnAgCu-Bi-Ni Pb-free Micro Solder Joints[J]. 2012, 17(3): 1-4.
DOI：

SUN Feng-lian, WANG Jia-bing, LIU Yang, et al. Electromigration of SnAgCu-Bi-Ni Pb-free Micro Solder Joints[J]. 2012, 17(3): 1-4. DOI：

摘要

以直径为400μm的SnAgCu-Bi-Ni(Ag1%)微焊点为对象

研究了微焊点在电流时效过程中的电迁移行为.对球栅阵列(ball grid array

BGA)焊点组装电路在不同温度下进行不同时长的电流时效试验.从焊点微观组织和硬度梯度的变化两个方面分析了电迁移现象的行为规律.研究结果表明

电迁移试验后焊点阴极区域金属间化合物(intermetallic compound

IMC)分解

附近形成大量微空洞

Cu焊盘大量消耗

焊点中部和阳极形成了大量(Cu

)6Sn5化合物

附近形成大量小丘

电迁移作用导致焊点内部微硬度形成由阳极向阴极递减的梯度分布

较高的试验温度显著加快电迁移进程.

Abstract

In this paper

the electromigration behavior of 400μm sized solder interconnects(SnAgCu-Bi-Ni

Ag1%) was investigated.Current stressing tests were conducted with assembled BGA package at different temperatures for different periods.The microstructure evoluation at the interface and hardness gradient distribution inside older bulk were studied.The results indicated that after the electromigration test

the intermetallic compounds(IMC) disappeared and a large number of micro voids appeared closet...

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