Geometrical Size Effects on the Performance of Micro-joint

SUN Feng-lian; ZHU Yan

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Geometrical Size Effects on the Performance of Micro-joint

更新时间：2026-07-10

- Geometrical Size Effects on the Performance of Micro-joint
- Vol. 17, Issue 2, Pages: 100-104(2012)
- 作者机构：
  
  哈尔滨理工大学材料科学与工程学院
- 作者简介：
- 基金信息：
- DOI：
  CLC： TG40
- Published：2012
- 稿件说明：
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SUN Feng-lian, ZHU Yan. Geometrical Size Effects on the Performance of Micro-joint[J]. 2012, 17(2): 100-104.
DOI：

SUN Feng-lian, ZHU Yan. Geometrical Size Effects on the Performance of Micro-joint[J]. 2012, 17(2): 100-104. DOI：

摘要

随着微电子产品向微型化、高性能方向发展

用于连接芯片与基板的微焊点尺寸也缩小到几十微米甚至几微米.在此细观尺度范围

传统焊点的力学、电学和金属学常数均呈现明显的尺寸效应.这必将对微焊点结构设计、可靠性分析及寿命评估产生重要影响.本文就有关细观尺度下

微焊点的几何尺寸、焊点形态对其微观力学性能、物理及金属学性能的影响进行综合评述.指出了目前研究微焊点可靠性过程中存在的问题

预测了基于几何尺寸效应研究微焊点的结构设计和寿命评估的未来研究趋势.

Abstract

With electronic products tending to become smaller

lighter and higher in performance

the solder joints used to connect chip and substrate have been miniaturized to just dozens of micron or a few micron.In the mesoscopic scale

the traditional mechanical

electrical and metallographic parameters for describing micro-joint have been influenced by geometrical size.This must seriously interfere with the evaluation for structure design

reliability and service time of micro-joint.In this paper

the relat...

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