Packaging Technology for Ka-band T / R Modules Based on LTCC Thick-thin Film Hybrid Substrate

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- Packaging Technology for Ka-band T / R Modules Based on LTCC Thick-thin Film Hybrid Substrate
- Modern Radar Vol. 39, Issue 9, Pages: 86-89(2017)
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崔鲁婧, 张兆华, 胡永芳, 纪乐. 基于LTCC 厚薄膜混合基板的Ka 波段T/ R 组件封装技术[J]. 现代雷达, 2017, 39(9): 86-89.

CUI Lujing, ZHANG Zhaohua, HU Yongfang, et al. Packaging Technology for Ka-band T / R Modules Based on LTCC Thick-thin Film Hybrid Substrate[J]. Modern Radar, 2017, 39(9): 86-89.
崔鲁婧, 张兆华, 胡永芳, 纪乐. 基于LTCC 厚薄膜混合基板的Ka 波段T/ R 组件封装技术[J]. 现代雷达, 2017, 39(9): 86-89. DOI：

CUI Lujing, ZHANG Zhaohua, HU Yongfang, et al. Packaging Technology for Ka-band T / R Modules Based on LTCC Thick-thin Film Hybrid Substrate[J]. Modern Radar, 2017, 39(9): 86-89. DOI：

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