Simulation and Analysis of Power Device′s Thermal Reliability Based on Electro-thermal Modeling

Chinese

您当前的位置：

首页 >

文章列表页 >

更新时间：2026-07-27

- Simulation and Analysis of Power Device′s Thermal Reliability Based on Electro-thermal Modeling
- Modern Radar Vol. 44, Issue 9, Pages: 93-98(2022)
- 作者机构：
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- 稿件说明：
移动端阅览
敬敏, 程禹, 陈学锋. 基于电热耦合模型的功率器件热可靠性仿真分析[J]. 现代雷达, 2022, 44(9): 93-98.

JING Min, CHENG Yu, CHEN Xuefeng. Simulation and Analysis of Power Device′s Thermal Reliability Based on Electro-thermal Modeling[J]. Modern Radar, 2022, 44(9): 93-98.
敬敏, 程禹, 陈学锋. 基于电热耦合模型的功率器件热可靠性仿真分析[J]. 现代雷达, 2022, 44(9): 93-98. DOI：

JING Min, CHENG Yu, CHEN Xuefeng. Simulation and Analysis of Power Device′s Thermal Reliability Based on Electro-thermal Modeling[J]. Modern Radar, 2022, 44(9): 93-98. DOI：

Views

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

No data

Related Author

No data

Related Institution

No data

AI问答

Postal code：100079
Tel：（010）53879206 Email：tmw@bjxintong.com.cn
Technical support is provided by Beijing Founder electronics co., LTD 京ICP备09082226号-64 京公网安备11010602201714号
It is recommended to read the content of this site in Chrome&IE9+. Please switch to extreme mode in browser 360.
Cookies We use cookies to help provide and enhance our service and tailor content. By continuing, you agree to the use of cookies.

⁰