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Power Integrity Analysis of High-speed PCB Multi-board Interconnection
更新时间:2026-08-29
    • Power Integrity Analysis of High-speed PCB Multi-board Interconnection

    • Vol. 23, Issue 9, Pages: 41-44(2023)
    • Published:2023

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  • Niu Sen, Zhang Minjuan, Yin Ziyan. Power Integrity Analysis of High-speed PCB Multi-board Interconnection[J]. 2023, 23(9): 41-44. DOI:

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