Optimization of Dispensing Patterns for Edge Bonding Adhesives

XING Zengcheng; YUAN Jingyi; ZHAO Yongzhi; Li Jiangbo; ZHANG Lixiang

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Optimization of Dispensing Patterns for Edge Bonding Adhesives

更新时间：2026-09-02

- Optimization of Dispensing Patterns for Edge Bonding Adhesives
- Electronic Product Reliability and Environmental Testing Pages: 1-7(2026)
- 作者机构：
  
  中国电子科技集团公司第十三研究所，河北石家庄 050000
- 作者简介：
- 基金信息：
- DOI：
  CLC：
- Received：10 March 2026，
  
  Revised：2026-06-18，
  
  Accepted：18 June 2026，
  
  Online First：02 September 2026，
- 稿件说明：
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邢增程,袁婧怡,赵永志等.边缘加固胶点涂方式优化[J].电子产品可靠性与环境试验,

XING Zengcheng,YUAN Jingyi,ZHAO Yongzhi,et al.Optimization of Dispensing Patterns for Edge Bonding Adhesives[J].Electronic Product Reliability and Environmental Testing,
邢增程,袁婧怡,赵永志等.边缘加固胶点涂方式优化[J].电子产品可靠性与环境试验, DOI：10.3969/j.issn.1672-5468...001.

XING Zengcheng,YUAN Jingyi,ZHAO Yongzhi,et al.Optimization of Dispensing Patterns for Edge Bonding Adhesives[J].Electronic Product Reliability and Environmental Testing, DOI：10.3969/j.issn.1672-5468...001.

摘要

由于陶瓷球栅阵列（CBGA）封装与基板热膨胀系数失配，致使焊点在温度循环载荷下易发生热应力疲劳失效。边缘加固胶可改善焊点应力状态，但不合理的点涂形式易在陶瓷基板中引起应力集中，进而导致开裂。目前，点涂形式对焊点保护与器件自身可靠性的协同影响机制尚不清晰。为此，本文设计多种典型点涂方案，结合温度循环试验与有限元仿真，系统考察不同点涂布局下焊点应力及陶瓷基板受力特征。结果表明，优化点涂形式不仅能显著降低焊点应力，同时避免对陶瓷基板造成附加损伤。研究揭示了点涂形式与封装可靠性的内在关联，可为CBGA器件边缘加固工艺设计与可靠性提升提供理论依据与技术参考。

Abstract

The ceramic-based ball grid array（CBGA）package has a coefficient of thermal expansion mismatch with the substrate，causing the solder joints to be prone to thermal stress fatigue failure under temperature cycling loads. Edge reinforcing glue can improve the stress state of the solder joints，but an improper application method can easily cause stress concentration in the ceramic substrate，thereby leading to cracking.Currently，the synergistic influence mechanism of the point coating form on the protection effect of the solder joints and the reliability of the device itself is not clear. Therefore，this paper designs several typical point coating schemes，combined with temperature cycling tests and finite element simulations，to systematically investigate the stress distribution of the solder joints and the force characteristics of the ceramic substrate under different point coating layouts. The results show that optimizing the point coating form can not only significantly reduce the stress of the solder joints but also avoid causing additional damage to the ceramic substrate. The study reveals the intrinsic relationship between the point coating method and the reliability of the package，providing theoretical basis and technical reference for the optimization design and reliability improvement of the edge reinforcing process of CBGA devices.

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references

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