The subsurface damage (SSD) layers of monocrystalline germanium wafers lapped by three different ways were measured and compared by the method of nanoindentation and micro morphology. Three ways such as ice-fixed abrasive

thermosetting fixed abrasive and free abrasive lapping were used to lap monocrystalline germanium wafers. The SSD depth was measured by a nanoindenter

and the subsurface morphology of SSD layer was observed by an atomic force microscope. The results show that the SSD layer of monocrystalline germanium wafer is mainly composed of soft corrosion layer and plastic scratch and crack growth layer. Compared with thermosetting fixed abrasive and free abrasive lapping

the SSD depth lapped with ice-fixed abrasive is shallower. Moreover

the SSD morphology of monocrystalline germanium wafer lapped with ice-fixed abrasive is superior to those of two other processing methods.