Interfacial reactions in thermoelectric modules

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- Interfacial reactions in thermoelectric modules
- Materials Research Letters Vol. 6, Issue 4, Pages: 244-248(2018)
- 作者机构：
  
  1. Department of Materials and Optoelectronic Science National Sun Yat-sen University
  2. Department of Chemical and Materials Engineering National Central University
  3. Computer Electrical and Mathematical Sciences and Engineering Division King Abdullah University of Science and Technology (KAUST)
  4. Department of Chemical Engineering National Tsing Hua University
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2018.1436092
  CLC：
- Online First：20 February 2018，
  
  Published：2018
- 稿件说明：
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Hsin-jay Wu, Albert T. Wu, Pai-chun Wei, et al. Interfacial reactions in thermoelectric modules[J]. Materials Research Letters, 2018, 6(4): 244-248.
DOI：

Hsin-jay Wu, Albert T. Wu, Pai-chun Wei, et al. Interfacial reactions in thermoelectric modules[J]. Materials Research Letters, 2018, 6(4): 244-248. DOI： 10.1080/21663831.2018.1436092.

BSTRACTEngineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the

values. Nevertheless

modular design holds a key factor to advance the TE technology. Herein

we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi

-based module

soldering is the primary bonding method

giving rise to the investigations on the selections of solder

diffusion barrier layer and electrode. For mid-temperature PbTe-based TE module

hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer

electrode and TE substrate are addressed as well.

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