BSTRACTStretchable electronics draw widespread attention with reported applications in various sectors

including health care

optoelectronics

and energy. However

irreversible interconnect deformation and direction-dependent stretchability may greatly limit the longevity and functionality of many stretchable systems operating under multidirectional

repetitive loading and unloading conditions. In this work

we introduce mechanical designs that can significantly enhance reversible

omnidirectional stretchability in a typical microsupercapacitor array. Simulation results from a series of computational studies demonstrate that structural buckling followed by out-of-plane deformation of interconnects are the fundamental physical mechanisms responsible for the increased stretchability. The present analytical methodology provides a computational framework for the effective design of other electronic systems with demanding deformability requirements.