Segregation-sandwiched stable interface suffocates nanoprecipitate coarsening to elevate creep resistance

Y. H. Gao; P. F. Guan; R. Su; H. W. Chen; C. Yang; C. He; L. F. Cao; H. Song; J. Y. Zhang; X.F. Zhang; G. Liu; J. F. Nie; J. Sun; E. Ma

doi:10.1080/21663831.2020.1799447

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Segregation-sandwiched stable interface suffocates nanoprecipitate coarsening to elevate creep resistance

Original Reports | 更新时间：2026-08-19

- Segregation-sandwiched stable interface suffocates nanoprecipitate coarsening to elevate creep resistance
- Materials Research Letters Vol. 8, Issue 12, Pages: 446-453(2020)
- 作者机构：
  
  1. a State Key Laboratory for Mechanical Behavior of Materials Xi’an Jiaotong University
  2. b Beijing Computational Science Research Center Beijing People’s Republic of China
  3. c School of Material and Environmental Engineering Hangzhou Dianzi University
  4. d International Joint Laboratory for Light Alloys (Ministry of Education) College of Materials Science and Engineering Chongqing University
  5. d International Joint Laboratory for Light Alloys (Ministry of Education) College of Materials Science and Engineering Chongqing University Chongqing People’s Republic of China
  6. e Department of Materials Science and Engineering Monash University
  7. f Department of Materials Science and Engineering Johns Hopkins University Baltimore
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2020.1799447
  CLC：
- Online First：30 July 2020，
  
  Published：2020
- 稿件说明：
移动端阅览
Y. H. Gao, P. F. Guan, R. Su, et al. Segregation-sandwiched stable interface suffocates nanoprecipitate coarsening to elevate creep resistance[J]. Materials Research Letters, 2020, 8(12): 446-453.
DOI：

Y. H. Gao, P. F. Guan, R. Su, et al. Segregation-sandwiched stable interface suffocates nanoprecipitate coarsening to elevate creep resistance[J]. Materials Research Letters, 2020, 8(12): 446-453. DOI： 10.1080/21663831.2020.1799447.

摘要

Abstract

We demonstrate a strategy to stabilize nanoprecipitates in Al–Cu alloys

based on computational design that identifies synergistic solutes (Sc and Fe) that simultaneously segregate to the

θ′

-Al

Cu/Al interface and strongly bond to one another. Furthermore

Sc and Fe are predicted to each segregate into a separate atomic plane

forming a sandwiched structure reinforcing the interface. This interfacial architecture was realized through a simple heat treatment in a Sc–Fe–Si triple-microalloyed Al–Cu model alloy. Such a back-to-back layered interface

thermodynamically stable and kinetically robust

is found to suffocate nanoprecipitate coarsening at 300°C

enabling a dramatic reduction in creep rate.

IMPACT STATEMENT

The segregant architecture of synergistic solute at

θ′

-Al

Cu/Al interface was guided by computational calculations and artificially realized at atomic scale to achieve an ultra-high thermal stability of

θ′

-Al

leading to a high creep resistance at 300°C.

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Related Author

Jinfeng Huang

Jiawei Fu

Cheng Zhang

Chao Zhao

Chenhui Zhu

Xiao Yang

Junyu Chen

Shujing Wang

Related Institution

a State Key Laboratory for Advanced Metals and Materials University of Science and Technology Beijing

c Yunnan Dirac Energy Technology Co. Ltd.

d College of Mechatronics Engineering North University of China

e National Joint Engineering Research Center for Abrasion Control and Molding of Metal Materials School of Materials Science and Engineering Henan University of Science and Technology

b School of Mechanical Engineering Nanjing University of Science and Technology

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