Frank W. DelRio, Scott J. Grutzik, William M. Mook, et al. Eliciting stable nanoscale fracture in single-crystal silicon[J]. Materials Research Letters, 2022, 10(11): 728-735.
DOI:
Frank W. DelRio, Scott J. Grutzik, William M. Mook, et al. Eliciting stable nanoscale fracture in single-crystal silicon[J]. Materials Research Letters, 2022, 10(11): 728-735.DOI: 10.1080/21663831.2022.2088251.
Eliciting stable nanoscale fracture in single-crystal silicon
we demonstrated stable nanoscale fracture in single-crystal silicon using an in-situ wedge-loaded double cantilever beam (DCB) specimen. The fracture toughness
K
IC
was calculated directly from instrumented measurement of force and displacement via finite element analysis with frictional corrections. Measurements on multiple test specimens were used to show
K
IC
= 0.72 ± 0.07 MPa m
1/2
on {111} planes and observe the crack-growth resistance curve in 500 nm increments. The exquisite stability of crack growth
instrumented measurement of material response
and direct visual access to observe nanoscale fracture processes in an ideally brittle material differentiate this approach from prior DCB methods.
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