With the vertical stacking of circuit layers

the power density of 3D-IC increases exponentially. Interlayer liquid cooling is a promising and scalable solution for high heat flux removal in 3D-IC (three-dimensional integration circuit). The flow and heat transfer performances of water through uniform and double-side heat flux 3D-IC of interlayer in-line micro-pin fins structure with heat transfer areas of 1cm2 and Reynolds number ranging from 150 to 900 were studied numerically. 3D-IC with in-line micro-pin fins for pitches of 200μm

diameter of 100μm and heights of 200μm was analyzed. Results show that interlayer liquid cooling of 3D-IC with in-line micro-pin fins has better heat exchange effect than that with rectangular micro-channels. For the Reynolds number of 770

the power reaches to 250W

which is equivalent to 8.3kW/cm3 volumetric heat. Compared with rectangular micro-channels，the average temperature and the maximal junction temperature of the heater surface with in-line micro-pin fins are only 46.34

13.96K

down by 13.26

21.34K

respectively.