Interface failure analysis of thermal barrier coatings under CMAS penetration

Zifan ZHANG; Yandong HAN; Weizhe WANG; Zhenwei CAI

doi:10.13224/j.cnki.jasp.20200374

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Interface failure analysis of thermal barrier coatings under CMAS penetration

Structure,Strength and Vibration | 更新时间：2025-04-07

- Interface failure analysis of thermal barrier coatings under CMAS penetration
- Journal of Aerospace Power Vol. 36, Issue 8, Pages: 1702-1711(2021)
- 作者机构：
  
  1.上海交通大学机械与动力工程学院，上海 200240
  2.中国石油天然气管道工程有限公司上海分公司，上海 200127
- 作者简介：
- 基金信息：
- DOI：10.13224/j.cnki.jasp.20200374
  CLC：
- 稿件说明：
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Zifan ZHANG, Yandong HAN, Weizhe WANG, et al. Interface failure analysis of thermal barrier coatings under CMAS penetration[J]. Journal of Aerospace Power, 2021, 36(8): 1702-1711.
DOI：

Zifan ZHANG, Yandong HAN, Weizhe WANG, et al. Interface failure analysis of thermal barrier coatings under CMAS penetration[J]. Journal of Aerospace Power, 2021, 36(8): 1702-1711. DOI： 10.13224/j.cnki.jasp.20200374.

摘要

基于钙镁铝硅等氧化物（CMAS）渗透对热障涂层陶瓷层（TC）热/力性能的改变，考虑温度梯度作用下不同CMAS渗透深度及CMAS渗透下界面表面粗糙度对界面温度分布，热生长氧化物（TGO）厚度及界面应力行为的影响。结果表明：CMAS的渗透使陶瓷层的热导率增加，进一步导致界面温度升高、TGO的厚度增大、界面的应力状态更为严重。界面表面粗糙度的增长则导致界面波峰波谷处的温度差异增大，界面TGO不均匀生长，最终引起界面的应力分布发生变化。

Abstract

Influences of different calcium，magnesium，aluminum，silicon and other oxides （CMAS） penetration depths under the influences of temperature gradients and the influences of the interface roughness on the interface temperature distribution under CMAS penetration were considered based on the influences of penetration on the properties of the ceramic layer of the thermal barrier coating （TC）.The influences of thermally growth oxide （TGO） thickness and interfacial stress behavior were also studied.The results showed that the penetration of CMAS increased the thermal conductivity of the ceramic layer，which further increased the interface temperature，the thickness of TGO，and also made the stress state of the interface more serious.The increase of the interface roughness led to an increase in the temperature difference between the peaks and valleys of the interface，the uneven growth of the interface TGO，and finally caused the change of the stress distribution of the interface.

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references

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