周超, 张利杰, 孟凡泽. Study on Mechanical Properties of Typical Hardware-strain Coupler Plate Under Deicing Impact[J]. Mechanical Science and Technology for Aerospace Engineering, 2026, 45(3): 404-412.
DOI:
周超, 张利杰, 孟凡泽. Study on Mechanical Properties of Typical Hardware-strain Coupler Plate Under Deicing Impact[J]. Mechanical Science and Technology for Aerospace Engineering, 2026, 45(3): 404-412. DOI: 10.13433/j.cnki.1003-8728.20240070.
Study on Mechanical Properties of Typical Hardware-strain Coupler Plate Under Deicing Impact
Regarding the study on the mechanical characteristics of the tension connecting plate under deicing impact and the optimization of the structure of the tension connecting plate
the existing study mainly focuses on the stress distribution of the tension connecting plate at a single time node
ignoring the issue of stress changes in the tension connecting plate throughout the entire time period. The present study establishes a finite element model for iced conductors and calculates the dynamic characteristics of 100% deicing under hazardous conditions. And a complete finite element model for hardware string was established
considering the supporting hardware such as tension connecting plates
and the mechanical properties tests of the hardware string under impact load were conducted. Based on the present model
the mechanical characteristics of the tensile connecting plate and supporting hardware under deicing impact were analyzed. It has found that a single time node stress cloud map of the tension joint plate cannot accurately distinguish the stress distribution in various regions of the tension joint plate. Under a single time node
the stress distribution of the tension joint plate has a certain gap with the stress distribution in various regions of the tension joint plate throughout the entire time period. The research results provide a more accurate reference basis for the study of mechanical properties and structural optimization design of tension connecting plates.