In order to study curing kinetics and heat resistance of supercritical silica(SCE-SiO 2 ) / polyether sulfone(PES) /diallyl bisphenol A(BBA) /bisphenol A diallyl oxide(BBE) /bismaleimide(MBMI)，(BBA BBE/MBMI expressed in MBAE). The micro morphology of the fracture surface was observed by SEM. Non-isothermalcuring kinetics of reaction process was studied with Differential Scanning Calorimetry (DSC). The content of SCE-SiO 2 influenced on the heat resistance of composites by thermal gravimetric analysis (TGA) . The results showedthat PES and SCE-SiO 2 uniformly dispersed in matrix，when the SCE-SiO 2 content and PES were appropriate，and its cross section exhibited ductile fracture，the apparent activation energy of composities were 92. 78 kJ/mol and96. 65 kJ/mol according to Kissinger and Ozawa equations，respectively. The curing kinetics equation was dα/dt =4. 77 ×10 8 (1 － α) 0. 91 e ( －11. 39/T) by Crane equation and the n-order kinetic model. When the content of SCE-SiO 2 was 2%，PES content was 5%，the thermal stability of composites was preferably，the thermal decomposition temperature was 445. 63℃ and improved 5. 8℃ than that of undoped material.