三维微处理器设计基本方法及前景分析

怡磊; 单光宝; 肖建青; 刘松

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三维微处理器设计基本方法及前景分析

更新时间：2026-09-04

- 三维微处理器设计基本方法及前景分析
- Analysis of Basic Methods and Prospect of 3D Microprocessor Design
- 微电子学与计算机 2016年33卷第8期页码：68-71
- 作者机构：
  
  西安微电子技术研究所,陕西,西安,710054
- 作者简介：
- 基金信息：
- DOI：
  中图分类号：
- 纸质出版：2016
- 稿件说明：
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怡磊, 单光宝, 肖建青, 刘松. 三维微处理器设计基本方法及前景分析[J]. 微电子学与计算机, 2016, 33(8): 68-71, 75.

YI Lei, SHAN Guang-bao, XIAO Jian-qing, et al. Analysis of Basic Methods and Prospect of 3D Microprocessor Design[J]. 2016, 33(8): 68-71.
怡磊, 单光宝, 肖建青, 刘松. 三维微处理器设计基本方法及前景分析[J]. 微电子学与计算机, 2016, 33(8): 68-71, 75. DOI：

YI Lei, SHAN Guang-bao, XIAO Jian-qing, et al. Analysis of Basic Methods and Prospect of 3D Microprocessor Design[J]. 2016, 33(8): 68-71. DOI：

摘要

介绍了三维处理器设计的基本内容

详细阐述了用于三维处理器中三维存储系统的设计方法及发展趋势

最后概括描述了目前三维处理器、三维存储系统设计中存在的问题

这将为国内三维处理器设计提供一定的借鉴.

Abstract

This paper introduces the fundamental contents of the three dimensional processor

describes the design methodology and development of the three dimensional storage system and discusses the development of the future development of three-dimensional processor. Finally

the paper concludes the existing problems in the design of 3D processors and 3D memory.

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references

D O Son, H J Choi, H G Jeon, et al. Thermal-aware 3D Multi-core Process-or Design using Core and Level-2 Cache Placement[J]. International Journal of Control and Automation, 2013, 25(6): 25-28. DOI: 25

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Lefter M, Voicu G R, Cotofana S D. A shared polyhedral cache for 3D wide-I/O multi-core computing platforms[C]// Circuits and Systems (ISCAS), 2015 IEEE International Symposium on. Portuqal: IEEE, 2015: 425-428.

李丽, 张宇昂, 傅玉祥, 等. 三维众核片上处理器存储架构研究[J]. 南京大学学报(自然科学版), 2014, 50(3): 330-334. DOI: 330

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