西南交通大学 微电子研究所,四川,成都,610031
纸质出版:2016
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石存明, 冯全源, 陈晓培. 一种900 V JTE结构VDMOS终端设计[J]. 微电子学与计算机, 2016, 33(4): 129-132.
SHI Cun-ming, FENG Quan-yuan, CHEN Xiao-pei. Design of 900 V JTE Structure VDMOS Termination[J]. 2016, 33(4): 129-132.
垂直双扩散金属氧化物场效应晶体管(Vertical Double-diffused Metal-Oxide-Semiconductor Field Transistor
VDMOS)是由Pbody与外延层之间形成的PN结承受电压
由于工艺限制
元胞区域只能设计为突变结
而终端区域最常用的结构为场限环
在原理上也相当于突变结耐压.结合结终端扩展(Junction Termination Extension
JTE)技术
引入缓变结耐压
设计了一款900 V的终端结构
实现了992.0 V的仿真击穿电压
终端效率达到了98.6%
而且有效终端长度仅有130.2 m
在较大程度上减小了芯片的占用面积
提高了击穿电压
而且工艺流程与成熟的深阱场限环基本一致
有较好的兼容性.
The breakdown voltage of Vertical Double-diffused Metal-Oxide-Semiconductor Field Transistor(VDMOS) is withstood by the PN junction form by Pbody and EPI. The cell region is designed as a abrupt junction because of the technique limitation.Field Limit Ring(FLR) is the most common structure used in termination region
and it can also take as a abrupt junction. In this paper
a 900 V termination structure is designed with the introduction of graded junction and the combination of Junction Termination Extension(JTE). The simulation breakdown voltage 992.0V with the effective termination length of only 130.2 m
and the efficiency is 98.6%. The chip area is significantly decreased
breakdown voltage is significantly increased
and the technique is the same to deep well FLRs
which means a good technique compatibility.
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吴克滂, 冯全源, 高晓蓉. 一款900 V VDMOS的VLD终端结构设计[J]. 电子元件与材料, 2015, 34(2): 43-46. DOI: 43
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