基于功能细分的硅通孔容错方法

杜高明; 曹舒婷; 张多利; 宋宇鲲; 高明伦

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基于功能细分的硅通孔容错方法

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- 基于功能细分的硅通孔容错方法
- A TSV Fault-Tolerance Method Based on Functional Segmentation
- 微电子学与计算机 2016年33卷第5期页码：142-146
- 作者机构：
  
  合肥工业大学微电子所,安徽,合肥,230009
- 作者简介：
- 基金信息：
  
  国家自然科学基金项目 61106020
- DOI：
  中图分类号：
- 纸质出版：2016
- 稿件说明：
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杜高明, 曹舒婷, 张多利, 宋宇鲲, 高明伦. 基于功能细分的硅通孔容错方法[J]. 微电子学与计算机, 2016, 33(5): 142-146, 152.

DU Gao-ming, CAO Shu-ting, ZHANG Duo-li, et al. A TSV Fault-Tolerance Method Based on Functional Segmentation[J]. 2016, 33(5): 142-146.
杜高明, 曹舒婷, 张多利, 宋宇鲲, 高明伦. 基于功能细分的硅通孔容错方法[J]. 微电子学与计算机, 2016, 33(5): 142-146, 152. DOI：

DU Gao-ming, CAO Shu-ting, ZHANG Duo-li, et al. A TSV Fault-Tolerance Method Based on Functional Segmentation[J]. 2016, 33(5): 142-146. DOI：

摘要

硅通孔(Through Silicon Via

TSV)技术是现今主流的三维芯片上下层互联技术之一.将从三维片上网络(Network on Chip

NoC)垂直通道的功能细分入手: 按照TSV重要性的不同划分成组

对不同的TSV组配置不同的冗余配置比.在现有的"包-连接电路"(PCC)平台上完成的实验显示

该冗余容错方案保证了在TSV总数达到十万量级时

成品率依然高达99.999 99%的同时

面积开销与非功能细分方案相比优化了35%以上.

Abstract

Through Silicon Via (TSV) technology is the mainstream of interconnection technology on 3-D stacked chips

this article implements a fault-tolerance scheme based on functional segmentation for vertical channel on 3D-NoC chips: according to the difference of importance of TSVs

we divide these TSVs into groups and configure different redundant proportion. The relevant experiments on PCC platform have shown that the fault-tolerant scheme keeps the target yield of 99.9999% when the number of TSVs reaches hundred thousand of magnitude and reduces the area overhead compared with other schemes based on non-functional segmentation by 35%.

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references

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