软件工程基于剖面映射的软硬件可靠性综合试验方法研究

封二强; 郑军; 蓝新生

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软件工程基于剖面映射的软硬件可靠性综合试验方法研究

更新时间：2026-09-04

- 软件工程基于剖面映射的软硬件可靠性综合试验方法研究
- Software and Hardware Integrated Reliability Testing Based on the Profile Mapping Method
- 微电子学与计算机 2017年34卷第2期页码：136-140
- 作者机构：
  
  中国航空综合技术研究所机构,北京,100028
- 作者简介：
- 基金信息：
  
  科工局课题 20121481
- DOI：
  中图分类号：
- 纸质出版：2017
- 稿件说明：
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封二强, 郑军, 蓝新生. 软件工程基于剖面映射的软硬件可靠性综合试验方法研究[J]. 微电子学与计算机, 2017, 34(2): 136-140.

FENG Er-qiang, ZHENG Jun, LAN Xin-sheng. Software and Hardware Integrated Reliability Testing Based on the Profile Mapping Method[J]. 2017, 34(2): 136-140.
封二强, 郑军, 蓝新生. 软件工程基于剖面映射的软硬件可靠性综合试验方法研究[J]. 微电子学与计算机, 2017, 34(2): 136-140. DOI：

FENG Er-qiang, ZHENG Jun, LAN Xin-sheng. Software and Hardware Integrated Reliability Testing Based on the Profile Mapping Method[J]. 2017, 34(2): 136-140. DOI：

摘要

为真实反映产品的实际使用情况

准确验证软硬件综合系统的可靠性

将软件可靠性测试以及硬件可靠性试验进行了综合

提出一种基于剖面映射的软硬件可靠性综合试验方法.该方法首先确定软件测试剖面以及综合环境应力剖面

然后利用剖面映射将软件测试剖面与综合环境应力剖面结合起来

形成软硬件可靠性综合试验剖面; 该综合试验剖面真实反映了软件运行和外部环境条件变化之间的关联

避免了软件可靠性测试和硬件可靠性试验分别进行所带来的试验风险和资源浪费

在减少测试代价的同时实现了一次试验即验证产品的可靠性.实验结果表明了该方法的可行性、合理性和有效性.

Abstract

To realistic simulate the actual usage

and accurately verify integrated hardware and software systems reliability

software and hardware integrated reliability testing based on the profile mapping method is proposed. First

the method construct the software testing profile and comprehensive environmental stress profile

then by the profile mapping method the software testing profile and the comprehensive environmental stress profile are integrated to form a comprehensive hardware and software reliability test profile; the combined test profile can realistically reflect the association between software operation and external environment changed condition

to avoid the test risks and the waste of resources. Finally

The Integrated testing method is feasible

reasonable and effective verified through a factual Display and control system experiment.

关键词

Keywords

references

Norman F. Schneidewind. Computer, network, software, and hardware engineering with applications[M]. John Wiley % Sons, 2012: 315-334. DOI: 315

Jinhee Park, Hyeon-Jeong Kim, Ju-Hwan Shin, and Jongmoon Baik. An embedded software reliability model with consideration of hardware related software failures[C]//IEEE Sixth International Conference on Software Security and Reliability. IEEE, 2012: 207-214.

Bing Huang, Manuel Rodriguez, Ming Li, et al. Hardware error likelihood induced by the operation of software[J]. IEEE Transactions on Reliability, 2011, 60(3): 622-640. DOI: 622

Javier Cano, David Rios. Reliability forecasting in complex hardware/doftware dystems[C]//ARES 2006. Vienna, 2006: 1-5.

Xiaolin Teng, Hoang Pham, Daniel R Jeske. Reliability modeling of hardware and doftwareinteractions, and its applications[J]. IEEE Transactions on Reliability, 2006, 55(4): 571-578. DOI: 571

Yudi Purwantoro, Stuart Bennett. Decomposition technique for integrated dependability rvaluation of hardware-doftware dystems using dtochastic activity networks[C]//The 25th EUROMICRO. Pisa, 1999: 142-145.

Choi M, Park N. Hardware-software co-reliability in field reconfigurable multi-processor-memory systems[C]//FTPDSWORKSHOP 2002. Los Angeles, 2002: 1-14.

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