Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films

R.L. Schoeppner; J.M. Wheeler; J. Zechner; J. Michler; H.M. Zbib; D.F. Bahr

doi:10.1080/21663831.2014.995380

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Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films

Original Reports | 更新时间：2026-08-19

- Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films
- Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films
- 材料研究快报（英文） 2015年3卷第2期页码：114-119
- 作者机构：
  
  1. School of Mechanical and Materials Engineering Washington State University Pullman 64 USA,WA991
  2. Empa Swiss Federal Laboratories for Materials Science and Technology Laboratory for Mechanics of Materials and Nanostructures
  3. School of Mechanical and Materials Engineering Washington State University Pullman
  4. School of Materials Engineering Purdue University West Lafayette
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2014.995380
  中图分类号：
- 网络首发：2015-01-02，
  
  纸质出版：2015
- 稿件说明：
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R.L. Schoeppner, J.M. Wheeler, J. Zechner, 等. Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films[J]. 材料研究快报（英文）, 2015,3(2):114-119.

R.L. Schoeppner, J.M. Wheeler, J. Zechner, et al. Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films[J]. Materials Research Letters, 2015, 3(2): 114-119.
R.L. Schoeppner, J.M. Wheeler, J. Zechner, 等. Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films[J]. 材料研究快报（英文）, 2015,3(2):114-119. DOI： 10.1080/21663831.2014.995380.

R.L. Schoeppner, J.M. Wheeler, J. Zechner, et al. Coherent Interfaces Increase Strain-Hardening Behavior in Tri-Component Nano-Scale Metallic Multilayer Thin Films[J]. Materials Research Letters, 2015, 3(2): 114-119. DOI： 10.1080/21663831.2014.995380.

摘要

Abstract

Strain-hardening in tri-component nano-scale metallic multilayers was investigated using nanoindentation and micro-pillar compression. Cu/Ni/Nb films were made in tri-layer structures as well as bi-layers consisting of an alloy of Cu–Ni/Nb. Strain-hardening increases as the layer thickness decreases

with 5 nm layers exhibiting higher strengths and hardening coefficients than 30 nm layers. The experimental evidence is described in light of the confined layer slip model

and supports the hypothesis that coherent interfaces with a modulus mismatch in the tri-layer system are responsible for additional deformation mechanisms that can lead to hardening in excess of that found in bi-layer systems.

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相关机构

b National Key Laboratory for Precision Hot Processing of Metals School of Materials Science and Engineering Harbin Institute of Technology

a School of Materials Science and Engineering Taizhou University

f Department of Physics Korea Advanced Institute of Science and Technology (KAIST)

e Gordon Center for Medical Imaging Department of Radiology Massachusetts General Hospital and Harvard Medical School Boston MA USA

d Department of Optics and Mechatronics Engineering Pusan National University

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