Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism

Barbara Putz; Oleksandr Glushko; Megan J. Cordill

doi:10.1080/21663831.2015.1105876

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Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism

Original Reports | 更新时间：2026-08-19

- Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
- Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism
- 材料研究快报（英文） 2016年4卷第1期页码：43-47
- 作者机构：
  
  Erich Schmid Institute of Materials Science Austrian Academy of Sciences and Department of Materials Physics Montanuniversität Leoben Jahnstrasse 12
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2015.1105876
  中图分类号：
- 网络首发：2015-10-27，
  
  纸质出版：2016
- 稿件说明：
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Barbara Putz, Oleksandr Glushko, Megan J. Cordill. Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism[J]. 材料研究快报（英文）, 2016,4(1):43-47.

Barbara Putz, Oleksandr Glushko, Megan J. Cordill. Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism[J]. Materials Research Letters, 2016, 4(1): 43-47.
Barbara Putz, Oleksandr Glushko, Megan J. Cordill. Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism[J]. 材料研究快报（英文）, 2016,4(1):43-47. DOI： 10.1080/21663831.2015.1105876.

Barbara Putz, Oleksandr Glushko, Megan J. Cordill. Electromigration in Gold Films on Flexible Polyimide Substrates as a Self-healing Mechanism[J]. Materials Research Letters, 2016, 4(1): 43-47. DOI： 10.1080/21663831.2015.1105876.

摘要

Abstract

The study of electromigration (EM) in metallisations for flexible thin film systems has not been a major concern due to low applied current densities in today's flexible electronic devices. However

the trend towards smaller and more powerful devices demands increasing current densities for future applications

making EM a reliability matter. This work investigates EM in 50 nm Au thin films with a 10 nm Cr adhesion layer on a flexible polyimide substrate at high current densities. Results indicate that EM does occur and could be used as a self-healing mechanism for flexible electronics.

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references

Stahlmecke B. Elektromigration in Gold und Silber Nanostrukturen [dissertation]. [Electromigration in gold and silver nanostructures] Duisburg (D): Fachbereich Physik der Universität Duisburg-Essen; 2008. (Open in a new window)Google Scholar

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相关机构

e Institute of Materials Science and Technology TU Wien

a Christian Doppler Laboratory for Surface Engineering of high-performance Components TU Wien Vienna Austria

d Department of Physics and Astronomy Uppsala University

c Plansee Composite Materials GmbH

b Oerlikon Balzers Oerlikon Surface Solutions AG

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