Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity

Peng Wan; Zhen Wu; Hui Zhang; Liyin Gao; Jingyang Wang

doi:10.1080/21663831.2015.1121167

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Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity

Original Reports | 更新时间：2026-08-19

- Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity
- Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity
- 材料研究快报（英文） 2016年4卷第2期页码：104-111
- 作者机构：
  
  1. Shenyang National Laboratory for Materials Science Institute of Metal Research Chinese Academy of Sciences Shenyang People's Republic of China,110016
  2. University of Chinese Academy of Sciences
  3. Shenyang National Laboratory for Materials Science Institute of Metal Research Chinese Academy of Sciences
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2015.1121167
  中图分类号：
- 网络首发：2016-01-08，
  
  纸质出版：2016
- 稿件说明：
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Peng Wan, Zhen Wu, Hui Zhang, 等. Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity[J]. 材料研究快报（英文）, 2016,4(2):104-111.

Peng Wan, Zhen Wu, Hui Zhang, et al. Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity[J]. Materials Research Letters, 2016, 4(2): 104-111.
Peng Wan, Zhen Wu, Hui Zhang, 等. Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity[J]. 材料研究快报（英文）, 2016,4(2):104-111. DOI： 10.1080/21663831.2015.1121167.

Peng Wan, Zhen Wu, Hui Zhang, et al. Porous Nano-SiC as Thermal Insulator: Wisdom on Balancing Thermal Stability, High Strength and Low Thermal Conductivity[J]. Materials Research Letters, 2016, 4(2): 104-111. DOI： 10.1080/21663831.2015.1121167.

摘要

Abstract

We herein show that by integrating nano-scale phonon-scattering mechanisms

such as interfaces and stacking faults thermal resistances in porous nano-SiC

this outstanding material (with intrinsic very high thermal conductivity) could demonstrate promising thermal insulation property. Porous nano-SiC prepared at 1

500°C exhibits a specific balanced mechanical strength (compressive and flexural strength are 26 and 13 MPa

respectively

with 57% porosity) and extremely low thermal conductivity (2 W m

−1

at 300 K); and sample sintered at 1

800°C shows excellent mechanical strength but relatively high thermal conductivity. Our work reports the novel low thermal conductivity of porous nano-SiC for the first time.

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