Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening

Jeong Min Park; Dae Cheol Yang; Han-Jin Kim; Dong Geun Kim; Sunghak Lee; Hyoung Seop Kim; Seok Su Sohn

doi:10.1080/21663831.2021.1913768

Chinese

您当前的位置：

首页 >

文章列表页 >

Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening

Original Report | 更新时间：2026-08-19

- Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening
- Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening
- 材料研究快报（英文） 2021年9卷第7期页码：315-321
- 作者机构：
  
  1. b Center for High Entropy Alloys Pohang University of Science and Technology
  2. c Department of Materials Science and Engineering Korea University
  3. a Department of Materials Science and Engineering Pohang University of Science and Technology Pohang Republic of Korea
  4. b Center for High Entropy Alloys Pohang University of Science and Technology Pohang Republic of Korea
  5. d Graduate Institute of Ferrous Technology Pohang University of Science and Technology
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2021.1913768
  中图分类号：
- 网络首发：2021-04-20，
  
  纸质出版：2021
- 稿件说明：
移动端阅览
Jeong Min Park, Dae Cheol Yang, Han-Jin Kim, 等. Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening[J]. 材料研究快报（英文）, 2021,9(7):315-321.

Jeong Min Park, Dae Cheol Yang, Han-Jin Kim, et al. Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening[J]. Materials Research Letters, 2021, 9(7): 315-321.
Jeong Min Park, Dae Cheol Yang, Han-Jin Kim, 等. Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening[J]. 材料研究快报（英文）, 2021,9(7):315-321. DOI： 10.1080/21663831.2021.1913768.

Jeong Min Park, Dae Cheol Yang, Han-Jin Kim, et al. Ultra-strong and strain-hardenable ultrafine-grained medium-entropy alloy via enhanced grain-boundary strengthening[J]. Materials Research Letters, 2021, 9(7): 315-321. DOI： 10.1080/21663831.2021.1913768.

摘要

Abstract

n equiatomic VCoNi medium-entropy alloy possesses high sensitivity to grain-boundary strengthening

achieved by severe lattice distortions. Its ultrafine-grain structure enables 1.5 Gigapascal yield strength even for the fully recrystallized alloy with a single face-centered cubic structure. The high density of grain boundaries also generates high back stresses via piling up of massive dislocations

and the low cross-slip probabilities produce not only robust dislocation-mediated plasticity but also high back stress contribution to flow stress

which affords high strain-hardening capability to ultrafine-grain alloys

with 1.7 Gigapascal ultimate tensile strength with remarkable ductility. Our approach provides a new method for developing ultrastrong metallic materials.

关键词

Keywords

references

浏览量

下载量

CSCD

文章被引用时，请邮件提醒。

提交

工具集

关联资源

Dilution-induced compositional transformation and mechanical degradation in multi-material directed energy deposition

Making high-W-content Ta-W alloys ductile via minor alloying of Hf

Achieving superior wear resistance on titanium alloy via large-span heterostructured coatings

Reaching unconventionally large Hall-Petch coefficients in face-centered cubic high-entropy alloys

Structure motif of chemical short-range order in a medium-entropy alloy

相关机构

b Singapore Institute of Manufacturing Technology (SIMTech) Agency for Science Technology and Research (A*STAR)

a Advanced Remanufacturing Technology Centre (ARTC) Agency for Science Technology and Research (A*STAR)

State Key Laboratory for Mechanical Behavior of Materials Xi'an Jiaotong University

d State Key Laboratory of Powder Metallurgy Central South University

c School of Materials Science and Engineering Harbin Institute of Technology

AI问答

地址：北京市丰台区顺八条1号院2号楼北阳晨光大厦2层邮编：100079
联系电话：（010）53879206 Email：tmw@bjxintong.com.cn
技术支持由北京北大方正电子有限公司提供京ICP备09082226号-64 京公网安备11010602201714号
本系统建议在Chrome、 IE9+ 以上版本浏览器阅读本站内容，360浏览器请切换至极速模式
Cookies帮助我们提供服务并提供个性化体验。使用本网站，即表示您同意我们使用Cookies

⁰