The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing

Huan Ding; Selami Emanet; Yehong Chen; Shengmin Guo

doi:10.1080/21663831.2023.2243990

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The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing

Original Reports | 更新时间：2026-08-19

- The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing
- The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing
- 材料研究快报（英文） 2023年11卷第10期页码：797-805
- 作者机构：
  
  Department of Mechanical and Industrial Engineering Louisiana State University Baton Rouge
- 作者简介：
- 基金信息：
- DOI：10.1080/21663831.2023.2243990
  中图分类号：
- 网络首发：2023-08-07，
  
  纸质出版：2023
- 稿件说明：
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Huan Ding, Selami Emanet, Yehong Chen, 等. The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing[J]. 材料研究快报（英文）, 2023,11(10):797-805.

Huan Ding, Selami Emanet, Yehong Chen, et al. The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing[J]. Materials Research Letters, 2023, 11(10): 797-805.
Huan Ding, Selami Emanet, Yehong Chen, 等. The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing[J]. 材料研究快报（英文）, 2023,11(10):797-805. DOI： 10.1080/21663831.2023.2243990.

Huan Ding, Selami Emanet, Yehong Chen, et al. The potential benefit of pseudo high thermal conductivity for laser powder bed fusion additive manufacturing[J]. Materials Research Letters, 2023, 11(10): 797-805. DOI： 10.1080/21663831.2023.2243990.

摘要

Abstract

This study examined the impact of transient pseudo high thermal conductivity to the fabrication of crack-free parts with Laser Powder-Bed-Fusion (L-PBF) based additive manufacturing (AM) method. Thermal diffusivity and thermal conductivity of L-PBF samples made by mixtures of IN939 alloy and Si powders were investigated. At temperatures above 800°C

the as-fabricated Si-doped IN939 was observed to exhibit an exceptionally high thermal conductivity

which can be attributed to the occurrence of endothermic reactions. This pseudo high thermal conductivity can effectively minimize the thermal stress and offers a potential solution to produce crack-free L-PBF parts for nonweldable alloys.

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相关机构

b Institute of Materials Science Joining and Forming Graz University of Technology

a Erich Schmid Institute of Materials Science Austrian Academy of Sciences

b Shi-changxu Innovation Center for Advanced Materials Institute of Metal Research Chinese Academy of Sciences

a School of Materials Science and Engineering University of Science and Technology of China Shenyang People’s Republic of China

b Key Laboratory of Metal High Performance Additive Manufacturing and Innovative Design MIIT China Northwestern Polytechnical University

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