The laminar flow and heat transfer characteristics of fluid were numerically investigated through uniform and double-side heat flux 3D-IC ( three-dimensional integration circuit) with interlayer heat-removal structure for heat transfer areas of 1cm2 and volume flow ringing from 36mL/min to 290mL/min. 3D-IC with rectangle micro-channels and staggered micro-pin fins for pitches of 200μm and structure heights of 200μm was analyzed. Results show that inter-layer liquid cooling of 3D-IC with staggered micro-pin fins has better heat exchange effect than that with rectangle micro-channels. For the heat flux density of 1.25MW/m2

the average temperature and maximum temperature of the heating surface are only 318.31

323.16K

decreased 12.31

20.14K than that with rectangle micro-channels at the volume flow of 290mL/min

corresponding to about total power of 250W and volume heat source of 8.3kW/cm3.