A double-layered microchannel heat sink with difference structure in each layer (B) was designed

and compared with structure A (the same complex structure in each layer) to reduce pressure drop and main good heat transfer performance. The effects of parallel flow

counter flow and different structures (PA

PB

CA

CB) on heat transfer performance were studied numerically. Moreover

the effect of synergy relationship between flow field and temperature field on heat transfer was analyzed by field synergy principle. The results showed that the average bottom temperature of parallel flow PA and PB was lower than that of counter flow CA and CB when Reynolds number ranged from 0 to 140. However

the average bottom temperature from low to high followed by PB

CB

PA and CA(when Reynolds number ranged from 140 to 250). From it

structure PB was adopted if there were high requirements for bottom temperature of microelectronics chips.From the view point of comprehensive heat transfer performance

the heat transfer performance and synergy angle of PB was better and smaller than others

indicating that it could improve the synergy relationship between flow field and temperature field obviously.