With the advent of 5G era and the rapid development of Internet of things

cloud computing

AI and other emerging technologies

data services have formed new features such as large capacity

large bandwidth

big connection and low latency. This requires data centers to achieve large-scale

rapid and flexible deployment and flexible expansion. The main problems faced by the traditional data center are as follows: construction cycle during a long; civil construction and business needs do not match; business deployment flexibility

scalability is not good. Based on the above contradictions

the application of micro-modular data center solutions with the characteristics of assembly and modularization came into being. This paper takes the research of double-layer and double-connected micro-module as an example

summarizes and shares the research process of new technology

and provides a reference for the followup product design.