CHEN Yu-fei, LI Zhi-chao, TENG Cheng-jun, et al. Study on Curing Reaction Kinetics of Bismaleimides Resin Modified by Epoxy Resin[J]. 2016, 21(3): 101-105.
CHEN Yu-fei, LI Zhi-chao, TENG Cheng-jun, et al. Study on Curing Reaction Kinetics of Bismaleimides Resin Modified by Epoxy Resin[J]. 2016, 21(3): 101-105.DOI: 10.15938/j.jhust.2016.03.020.
In order to analyze curing kinetics and curing process of epoxy resin (E-51)/diallylbisphnol A (BBA)/Diallyl ether of bisphenol A ( BBE )/bismaleimides ( E-51/BBA/BBE/MBMI)
Differential Scanning Calorimetry (DSC) was applied for the temperature curve. Characteristic temperature (Ti: initial curing temperature
Tf: the highest curing rate temperature
Tf: the curing terminate rate temperature) and the heating speed were made characteristic equations
and Ti: 158.2℃
Tp : 181.2℃ and Ts: 220. 1℃ were acquired by extrapolation method. So the curing process of resin system was 100℃/1 h→130℃/1 h →160℃/1 h→180℃/2 h→200℃/1 h →220℃/1 h. Kissinger method and Ozawa method were adopted for curing dynamic apparent activation energy (AE) of resin system