微系统集成全新阶段——IC芯片与电子集成封装的融合发展

缪旻; 金玉丰

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微系统集成全新阶段——IC芯片与电子集成封装的融合发展

更新时间：2026-09-04

- 微系统集成全新阶段——IC芯片与电子集成封装的融合发展
- A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging
- 微电子学与计算机 2021年38卷第1期页码：1-6
- 作者机构：
  
  1. 北京信息科技大学机构信息微系统研究所,北京,100101
  2. 北京大学深圳研究生院,深圳,518055
- 作者简介：
- 基金信息：
  
  国家自然科学基金 61674016国家自然科学基金 62074017国家重点基础研究发展计划(973计划)项目 2015CB057201
- DOI：
  中图分类号：
- 纸质出版：2021
- 稿件说明：
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缪旻, 金玉丰. 微系统集成全新阶段——IC芯片与电子集成封装的融合发展[J]. 微电子学与计算机, 2021, 38(1): 1-6.

MIAO Min, JIN Yu-feng. A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging[J]. 2021, 38(1): 1-6.
缪旻, 金玉丰. 微系统集成全新阶段——IC芯片与电子集成封装的融合发展[J]. 微电子学与计算机, 2021, 38(1): 1-6. DOI：

MIAO Min, JIN Yu-feng. A new stage for microsystem integration-the integrated development of integrated circuits chips and system-level electronic packaging[J]. 2021, 38(1): 1-6. DOI：

摘要

拓展摩尔定律已成为集成电路及电子信息通信硬件产业的重大战略之一

其中微系统技术发展进入全新阶段

集成电路芯片与集成封装组件的界限日渐模糊

形成了融合发展的新局面

正对微系统异质集成技术领域发展产生深远影响.结合团队科研实践

本文从架构演进、芯片-封装一体化设计策略、多物理域协同分析与优化、集成平台的重大创新等层面

分析IC与集成封装融合发展阶段的技术特征、内涵与动向

并对未来应用前景、发展路径进行展望.

Abstract

"More than Moore" has become the preferred strategy for integrated circuit and electronic

information and telecommunication hardware industries and therefore has just promoted microsystem technology onto a new stage

whereon the boundary between IC (integrated circuit) chips and system-level electronic package has become increasingly blurred

triggering a fashion of integrated development of two domain. This new stage is now exerting a far-reaching influence on the development of microsystem heterogeneous integration domain. Consequently

based on the personal scientific research practice

the characteristics

connotations and trends are analyzed and inferred in-depth for this whole new IC-package co-development stage

from the perspective of architecture evolution

chip-package co-design strategy

multi-physics co-analysis and co-optimization

and major technical innovations in integrated assembling and manufacturing; in addition

the future applications are prospected and the path of evolution is suggested.

关键词

Keywords

references

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许居衍.复归于道--封装改道芯片业(演讲记录稿)[J].电子与封装, 20 19, 19( 10): 1-3. DOI: 10. 16257/j.cnki. 168 1- 1070.20 19. 100 1. XU J Y.Back to the Origin-Packaging are Changing the Path of IC Industry: a Transcript for the Keynote Speech[J]. Electronics % Packaging, 20 19, 19( 10): 1-3. DOI: 10. 16257/j.cnki. 168 1- 1070.20 19. 100 1.

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